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# Design Rule Verification Report

Date | : | 2023/6/8
Time | : | 14:58:28
Elapsed Time | : | 00:00:00
Filename | : | E:\我的坚果云\【单片机】\【0我的工程】\【---数控电源3.0\A-底层驱动板\数控源9.8-竞赛开源\数控源-A9.8.PCBDOC

Warnings | : | 0
Rule Violations | : | 6

## Summary

Warnings | Count
--- | ---
Total | 0

Rule Violations | Count
--- | ---
Hole Size Constraint (Min=0.0254mm) (Max=2.54mm) (All) | 0
Height Constraint (Min=0mm) (Max=25.4mm) (Prefered=12.7mm) (All) | 0
Width Constraint (Min=0.2mm) (Max=2mm) (Preferred=0.3mm) (All) | 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) | 0
Clearance Constraint (Gap=0.2mm) (All),(All) | 1
Broken-Net Constraint ( (All) ) | 0
Short-Circuit Constraint (Allowed=No) (All),(All) | 5
Total | 6

Clearance Constraint (Gap=0.2mm) (All),(All)
Pad Z-1(360.25mm,219.25mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer

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Short-Circuit Constraint (Allowed=No) (All),(All)
Pad Z-0(358.65mm,216.65mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer
Pad Z-0(361.85mm,216.65mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer
Pad Z-0(358.65mm,221.85mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer
Pad Z-1(360.25mm,219.25mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer
Pad Z-0(361.85mm,221.85mm) Multi-Layer | Pad Z-0(360.25mm,219.25mm) Bottom Layer

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