描述
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">* 1、项目功能介绍</h3>
<hr class="horizontal-splitline normal-bold-2"><strong><span style="color:#95a5a6;"><span style="font-size:14px;">支持Klipper固件的3D打印机主板,支持4路可控风扇,8个ADC输入,八个步进电机驱动,PT100输入,三路高功率MOS管,最高支持两个热头,一个热床</span></span></strong></div>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">*2、项目属性</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"><span style="color:#95a5a6;font-size:14px;">根据STM32H723VGH6的官方手册进行分配IO,本质上是嵌入式单片机,根据九州主板进行修改,缩减板子尺寸,尽量做到10*10cm以内,让更多的人使用到</span><span style="color:#95a5a6;font-size:14px;">。</span></p>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">* 3、开源协议</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"><span style="color:#95a5a6;font-size:14px;">GPL3.0</span></p>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">*4、硬件部分</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"><span style="color:#95a5a6;"><span style="font-size:14px;">使用嘉立创EDA专业版,采用BGA六层板,以STM32H723VGH6为主控,最高频率达到500mhz,5路可控风扇,3路常开风扇,8个ADC输入,八个步进电机驱动,PT100输入,高功率MOS管,支持UART及无限位归零,不支持SPI驱动,PROBE光耦隔离,且能自由选择电压,支持5v 12v vcc三种电压范围,RGB灯光电路隔离</span></span></p>
<h1>项目相关功能与特点</h1>
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<ul>
<li>各端口ESD防护,步进电机反电动势保护;</li>
<li>使用嘉立创EDA专业版,采用BGA六层沉金板;</li>
<li>ARM-H7 500MHZ主控;</li>
<li>可拔插保险管;</li>
<li>两个加热头和一个加热床,采用大功率DFN封装MOSFET;</li>
<li>五路可控风扇(喉管/吹料),三路常开风扇(主板、驱动散热);</li>
<li>风扇电压24V选择;</li>
<li>四路NTC100K测温;</li>
<li>支持PT100高温传感器;</li>
<li>X/Y/Z 限位,并额外预留一路限位;</li>
<li>八轴可更换步进电机驱动;</li>
<li>步进电机工作模式支持STEP/DIR标准模式、TMC UART模式;</li>
<li>板载32Kb EEPROM;</li>
<li>10*10 BGA六层板,用料更加稳定;</li>
<li>3DTOUCH 自动调平传感器接口;</li>
<li>RST按键/BOOT0接口/SWD调试下载接口;;</li>
<li>支持Klipper或Marlin固件;</li>
<li>type-c通信接口;</li>
<li>CAN通信接口;</li>
<li>PROBE接近开关接口光耦隔离(支持电压选择);</li>
<li>RGB接口(支持电压选择);</li>
<li>支持堵转检测(需使用支持堵转检测的驱动,例如TMC2209等);</li>
<li>采用 Type-C 接口,支持联机打;</li>
<li>采用专用电源芯片,支持 24V 电源输入;</li>
<li>采用高性能 MOSFET 管,散热效果更好</li>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">*5、软件部分</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"><span style="color:#95a5a6;"><span style="font-size:14px;">使用STM32CUBE或者FLYmcu进行烧录</span></span></p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">使用上位机进行STM323H723VGH6,12MHZ晶振,无BL进编译,使用type-c烧录时,boot0拉高</p>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">*6、BOM清单</h3>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">*7、大赛LOGO验证</h3>
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<p style="line-height:1.8;"><img src="//image.lceda.cn/pullimage/OFzvUIs0TG3wlul1HnmKh9tBpCqBPBkeWcsSu14a.jpeg" alt=""><img src="//image.lceda.cn/pullimage/wLxwWTPZ3U8LNJPCkC6GcUnu0OUg2Eg9qM7Y53Mp.jpeg" alt="" width="720" height="960"></p>
<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">* 8、演示您的项目并录制成视频上传</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">视频在附件</p>
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