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#第六届立创电赛#可编程加热焊台

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<div class="document"> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"> </p> <h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">* 1、项目功能介绍</h3> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">该模块采用HK32F030MF4P6作为主控,使用MAX6675进行温度测量,并通过串口与上位机通信,进行复杂控制,并提供按键就行简单温度设置。</p> <h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">*2、项目属性</h3> <hr class="horizontal-splitline normal-bold-2"> <h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">MAX6675测温在HK32上的使用,并通过串口控制精确控温。</h3> <h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">* 3、开源协议</h3> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"> </p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">注:利他即利己,请认真阅读下述内容。</span></p> <ol style="line-height: 1.8;"> <li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">拥抱开源,赋予项目无限价值。建议项目核心功能开源80%以上;</span></li> <li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">若某一部分功能不可替代且删掉之后项目无法解决对应的问题,则这一部分实现的功能就是项目的核心功能;比如设计了一台电子负载且设计了一款上位机软件监控功率变化,则电子负载为核心功能,上位机软件为辅助功能;比如电子负载中使用了一款隔离485模块与上位机通信,则此485模块实现的通讯功能为辅助功能;</span></li> <li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">项目应选择适合自己的<span style="text-decoration: underline;"><a href="/posts/98fdb2accd754af7b51990790db3b47a" target="_blank">开源协议</a></span>,若项目引用其他开源项目,应注明来源并遵循原作者的开源协议规定;原创项目推荐使用GPL3.0开源协议;</span></li> <li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">直接引用开源项目的原电路或原代码实现的功能不可作为自己项目的核心功能、使用市场上通用模块直接实现的功能不可作为自己项目的核心功能。</span></li> </ol> <p style="line-height: 1.8;"> </p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><strong><span style="color: #0093e6;">请在竞赛阶段填写 ↓</span></strong></p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"> </p> <h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">*4、硬件部分</h3> <hr class="horizontal-splitline normal-bold-2"> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">使用MAX6675热电偶测温芯片,HK32F030MF4P6,</p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">0.96寸I2C的OLED显示屏模块</p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"> </p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">注:推荐使用<span style="text-decoration: underline;"><a href="https://lceda.cn/editor" target="_blank">立创EDA</a></span>。若选择其他EDA工具,请在附件上传PDF格式的原理图,PDF格式的PCB图纸,Gerber格式的PCB文件。这里可以详细说明您的项目实现原理和机制、注意事项、调试方法</span></p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><span style="font-size: 14px;">更多详情:<a href="/posts/06c94d90c2c447dfbd9ed7339ff4a5b1" target="_blank">https://diy.szlcsc.com/posts/06c94d90c2c447dfbd9ed7339ff4a5b1</a></span></p> <p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"> </p> </div>

文档

Sheet_1

PCB_#第六届立创电赛#可编程加热焊台

BOM

ID Name Designator Footprint Quantity Manufacturer Part Manufacturer Supplier Supplier Part
1 100nF C1 C0402 1
2 100nF C2 C0603 1
3 470u C5,C6 CAP-D8.0XH10.5 2
4 100n C8 C0805 1
5 100nF C13 C0603 1
6 10K R1,R2,R3,R7 R0402 4
7 220 R6 R0603 1
8 TS24CA RST1,RST2,RST3,RST4 SW-SMD_TS24CA 4
9 HK32F030MF4P6 U1 TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL 1
10 DBT30C-7.62-2P U2,U3,U4,U9 CONN-TH_2P-P7.62_DBT30C-7.62-2P 4
11 REG1117-3.3 U15 SOT-223-4_L6.5-W3.5-P2.30-LS7.0-BR 1

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