描述
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">1、项目功能介绍</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><strong><span style="text-decoration: line-through;">HK32F103CBT6A </span>STM32f103cbt6制作的daplink烧录调试器,支持如下功能:</strong></p>
<ul>
<li>Arm-cortex芯片的调试和烧录(HID)</li>
<li>自带虚拟串口,省去usb转串口(CDC)</li>
<li>拖拽式编程,模拟出u盘,hex或者bin拷贝进行完成烧录(MSC)</li>
<li>WEBUSB功能</li>
<li>带有一块128*64的OLED显示屏,和2个功能按键</li>
<li>支持离线烧录,自制烧录算法。</li>
</ul>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">解决了程序开发过程中需要外接串口调试的问题。离线烧录功能解决了批量烧写问题。</p>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">由于usb驱动问题目前hk芯片不能正常使用,已换回STM32f103cbt6,功能一切正常,以后我再尝试hk。</p>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><img src="//image.lceda.cn/pullimage/SSpQ6QdESf3gLmlxgZlrOsCzjIeyN1W5J1Nk0GW6.png" alt="" width="725" height="426"><img src="//image.lceda.cn/pullimage/akhrgxSifSLSB2aGZwBVi3kj9koo2Q0oXATbGVjD.png" alt="" width="726" height="408"></p>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">2、项目属性</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">PCB设计为本人原创。原理图和程序修改自ARM官方开源项目<span style="text-decoration: line-through;">,移植到hk32上</span>。</p>
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<h3 class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">3、开源协议</h3>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">GPL 3.0</p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;">程序修改自https://github.com/ARMmbed/DAPLink</p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">注:利他即利己,请认真阅读下述内容。</span></p>
<ol style="line-height: 1.8;">
<li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">拥抱开源,赋予项目无限价值。建议项目核心功能开源80%以上;</span></li>
<li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">若某一部分功能不可替代且删掉之后项目无法解决对应的问题,则这一部分实现的功能就是项目的核心功能;比如设计了一台电子负载且设计了一款上位机软件监控功率变化,则电子负载为核心功能,上位机软件为辅助功能;比如电子负载中使用了一款隔离485模块与上位机通信,则此485模块实现的通讯功能为辅助功能;</span></li>
<li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">项目应选择适合自己的<span style="text-decoration: underline;"><a href="/posts/98fdb2accd754af7b51990790db3b47a" target="_blank">开源协议</a></span>,若项目引用其他开源项目,应注明来源并遵循原作者的开源协议规定;原创项目推荐使用GPL3.0开源协议;</span></li>
<li class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-hanging-indent-1.6em" style="line-height: 1.8;"><span style="color: #95a5a6; font-size: 14px;">直接引用开源项目的原电路或原代码实现的功能不可作为自己项目的核心功能、使用市场上通用模块直接实现的功能不可作为自己项目的核心功能。</span></li>
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