描述
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">本工程使用立创EDA专业版绘制电路板，嘉立创打板。MCU采用国民技术的N32G430C8L7单片机，与STM32F103C8T6十分相似，便于学习，易于上手。电流检测使用INA199分流监控器，电压检测使用分压电路·测量。显示设备使用0.91寸OLED显示屏，通过I²C总线传输数据。</p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"> </p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;"><img src="//image.lceda.cn/pullimage/2rdAgdWeFfP0MDsBIbSOJ2YkOq77YnCI6206212K.jpeg" alt="" width="1200" height="960"></p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-left-indent-1.6em" style="line-height:1.8;">使用加热板和低温无铅锡膏进行器件焊接，辅以助焊膏调整附着焊锡量，完成焊接后使用有机溶剂对表面进行擦洗。</p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-left-indent-1.6em" style="line-height:1.8;">完成焊接工作后，使用电表简单测量，排查问题，点灯正常，再进行功能程序实现。</p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-left-indent-1.6em" style="line-height:1.8;"> </p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-left-indent-1.6em" style="line-height:1.8;"><img src="//image.lceda.cn/pullimage/rVjTq5vQp4inRWATVy9rglCpn4rpNZi7w753qS7Y.jpeg" alt="" width="1200" height="960"></p>
<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt pap-left-indent-1.6em" style="line-height:1.8;">使用Keil MDK5，通过SW协议烧录程序。</p>
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<p class="paragraph text-align-type-left pap-line-1.3 pap-line-rule-auto pap-spacing-before-3pt pap-spacing-after-3pt" style="line-height:1.8;">本打算用FM8002A实现发声功能，由于设计失误无法实现，修改后的工程尚未经实物验证。要开学了，剩下的东西以后再补</p>
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